• DocumentCode
    2052387
  • Title

    A study of SONOS charge loss mechanism after hot-hole stressing using trap-layer engineering and electrical re-fill methods

  • Author

    Hsiao, Yi-Hsuan ; Lue, Hang-Ting ; Lee, M.Y. ; Huang, Shih-Chieh ; Chou, Tsung-Yi ; Wang, Szu-Yu ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan

  • Author_Institution
    Macronix Int. Co. Ltd., Hsinchu
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    695
  • Lastpage
    696
  • Abstract
    The high-Vt state data retention of 2bit/cell SONOS using hot-hole erasing method is studied extensively using a 0.13 mum virtual-ground array NOR-type test chip. We design various trap-layer engineering using multi-layer stacks of SiN and SiON in order to change the intra-nitride conduction. However, our results show that the post-cycled retention is insensitive to the trap-layer engineering. Next, we apply the electrical refill method to test the retention, and find that retention can be improved. Hence our results supports the trap assisted charge loss mechanism. Finally, using a novel bit-by-bit tracking technique, we find that the retention behavior of an individual bit has a random but wide distribution, and some tail bits even show abnormal charge gain. This suggests that both electron and hole de-trapping happen during retention.
  • Keywords
    hole traps; hot carriers; integrated circuit testing; silicon compounds; 2bit-cell SONOS; SONOS charge loss mechanism; SiN; SiON; bit-by-bit tracking technique; electrical refill method; electron de-trapping; high-Vt charge loss mechanism; high-Vt state data retention; hole de-trapping; hot-hole erasing method; intra-nitride conduction; multilayer stacks; silicon-oxide-nitride-oxide-silicon; size 0.13 mum; trap assisted charge loss mechanism; trap-layer engineering; virtual-ground array NOR-type test chip; Data engineering; Degradation; Design engineering; Electron traps; Hot carriers; SONOS devices; Silicon compounds; Stress; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558993
  • Filename
    4558993