DocumentCode :
2052387
Title :
A study of SONOS charge loss mechanism after hot-hole stressing using trap-layer engineering and electrical re-fill methods
Author :
Hsiao, Yi-Hsuan ; Lue, Hang-Ting ; Lee, M.Y. ; Huang, Shih-Chieh ; Chou, Tsung-Yi ; Wang, Szu-Yu ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Macronix Int. Co. Ltd., Hsinchu
fYear :
2008
fDate :
April 27 2008-May 1 2008
Firstpage :
695
Lastpage :
696
Abstract :
The high-Vt state data retention of 2bit/cell SONOS using hot-hole erasing method is studied extensively using a 0.13 mum virtual-ground array NOR-type test chip. We design various trap-layer engineering using multi-layer stacks of SiN and SiON in order to change the intra-nitride conduction. However, our results show that the post-cycled retention is insensitive to the trap-layer engineering. Next, we apply the electrical refill method to test the retention, and find that retention can be improved. Hence our results supports the trap assisted charge loss mechanism. Finally, using a novel bit-by-bit tracking technique, we find that the retention behavior of an individual bit has a random but wide distribution, and some tail bits even show abnormal charge gain. This suggests that both electron and hole de-trapping happen during retention.
Keywords :
hole traps; hot carriers; integrated circuit testing; silicon compounds; 2bit-cell SONOS; SONOS charge loss mechanism; SiN; SiON; bit-by-bit tracking technique; electrical refill method; electron de-trapping; high-Vt charge loss mechanism; high-Vt state data retention; hole de-trapping; hot-hole erasing method; intra-nitride conduction; multilayer stacks; silicon-oxide-nitride-oxide-silicon; size 0.13 mum; trap assisted charge loss mechanism; trap-layer engineering; virtual-ground array NOR-type test chip; Data engineering; Degradation; Design engineering; Electron traps; Hot carriers; SONOS devices; Silicon compounds; Stress; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
Type :
conf
DOI :
10.1109/RELPHY.2008.4558993
Filename :
4558993
Link To Document :
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