Title :
IC performance prediction system
Author :
Ramakrishnan, V. ; Walker, D.M.H.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
This paper presents a methodology for predicting the electrical performance of integrated circuits prior to packaging and final test. A simulation-based approach is used to build response surface prediction models. The work focuses on determining the optimal set of test measurements required for on-line product-based control, package selection, binning and die selection for MCMs
Keywords :
circuit analysis computing; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; multichip modules; IC performance prediction; MCMs; binning; die selection; electrical performance; on-line product-based control; package selection; response surface prediction models; simulation-based approach; test measurements; Circuit testing; Costs; Fabrication; Foundries; Integrated circuit packaging; Integrated circuit testing; Packaging machines; Predictive models; Semiconductor device packaging; Wafer scale integration;
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2992-9
DOI :
10.1109/TEST.1995.529858
