DocumentCode
2052632
Title
Special feature of forming solid planar diffusion a source for submicron structure
Author
Berezhansky, Volodymyr
fYear
2010
fDate
23-27 Feb. 2010
Firstpage
364
Lastpage
364
Abstract
Solid planar diffusion a source for forming submicron structure VLSI are given in this paper.
Keywords
VLSI; borosilicate glasses; diffusion; plasma applications; B2O3-SiO2; borosilicate glass; ionic-plasma processing; large-scale integrated circuit; solid planar diffusion; submicron structure VLSI; Boron; Dielectric films; Glass; Impurities; Nitrogen; Plasma temperature; Production; Semiconductor films; Silicon; Very large scale integration; borazine; ionic-plasma processing technique; silane;
fLanguage
English
Publisher
ieee
Conference_Titel
Modern Problems of Radio Engineering, Telecommunications and Computer Science (TCSET), 2010 International Conference on
Conference_Location
Lviv-Slavske
Print_ISBN
978-966-553-875-2
Electronic_ISBN
978-966-553-901-8
Type
conf
Filename
5445984
Link To Document