Title :
Physical framework for NBTI: Insight from ultra-fast switching measurement of NBTI recovery
Author :
Du, G.A. ; Ang, D.S. ; Hu, Y.Z. ; Wang, S. ; Ng, C.M.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fDate :
April 27 2008-May 1 2008
Abstract :
Using an ultra-fast switching measurement method, the mechanism of NBTI recovery in the first few seconds after stress termination is systematically studied. Results show: (1) A component of the fast |DeltaVt| recovery increases with stress temperature; (2) the amount of |DeltaVt| recovery is (i) independent of stress time under a negative gate recovery voltage, but (ii) increases with stress time for a positive gate recovery voltage. These observations suggest the following physical framework for NBTI: (1) Dynamic balance of rapid inelastic trapping and detrapping of holes in a narrow energy band above Si valence band edge, which accounts for the fast recovery observed, independent of stress time and (2) generation of interface states and interfacial deep-level positive trap states (above Si mid-gap) which exhibit time-dependent recovery under a positive gate recovery voltage.
Keywords :
MOSFET; electric potential; elemental semiconductors; high-speed techniques; interface states; semiconductor device models; silicon; stress analysis; thermal stability; NBTI recovery mechanism; Si; holes detrapping; interface states; interfacial deep-level positive trap states; narrow energy band; negative gate recovery voltage; physical framework; polysilicon gate p-MOSEET; positive gate recovery voltage; rapid inelastic hole trapping; stress temperature; stress termination; stress time; ultra-fast switching measurement method; Electric variables measurement; Electron traps; Energy states; Interface states; MOSFET circuits; Niobium compounds; Stress; Temperature dependence; Titanium compounds; Voltage;
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
DOI :
10.1109/RELPHY.2008.4559013