DocumentCode
2052839
Title
Impact of PVT variation on delay test of resistive open and resistive bridge defects
Author
Shida Zhong ; Khursheed, Saqib ; Al-Hashimi, B.M.
Author_Institution
Sch. of ECS, Univ. of Southampton, Southampton, UK
fYear
2013
fDate
2-4 Oct. 2013
Firstpage
230
Lastpage
235
Abstract
This paper presents an in-depth analysis of resistive open and resistive bridge defects behavior under process, voltage and temperature (PVT) variation using delay test. Using HSPICE with 65-nm and 45-nm gate libraries, this paper demonstrates that PVT variation has a negative impact on detectability of these two defects. To address this issue, this paper determines the appropriate voltage and temperature settings for detecting resistive open and bridge defects. This is identified by analyzing the timing critical resistance of these two defects under the combined effect of PVT variation. In addition, this work determines the most effective delay test class that achieves maximum coverage for resistive open defect.
Keywords
SPICE; bridge circuits; fault diagnosis; integrated circuit reliability; integrated circuit testing; HSPICE; PVT variation; defect detectability; delay test; gate libraries; negative impact; process voltage and temperature variation; resistive bridge defects behavior; resistive open defects behavior; size 45 nm; size 65 nm; temperature settings; timing critical resistance; voltage settings; Discrete Fourier transforms; Fault tolerance; Fault tolerant systems; Resistance; Resistive open; delay test; process variation; resistive bridge; temperature variation; voltage variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2013 IEEE International Symposium on
Conference_Location
New York City, NY
ISSN
1550-5774
Print_ISBN
978-1-4799-1583-5
Type
conf
DOI
10.1109/DFT.2013.6653611
Filename
6653611
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