Title :
Influence of environment on the fatigue of Pb-Sn solder joints
Author :
Guo, Z. ; Sprecher, A.F. ; Jung, D.Y. ; Conrad, H.
Author_Institution :
Dept. of Mater. Sci. & Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
The effect of a vacuum (~10-6 torr) on the low-cycle fatigue life (25%, 50%, 75%, and 95% drop in load) of 10Sn90Pb and 63Sn37Pb solder joints tested in shear was investigated in total strain control (by Δγt=0.006 to 0.5, ν=0.1 Hz ramp cycling) at 300 K. The influence of a grease coating was also determined for the 63Sn37Pb alloy for Δγt=0.07 to 0.8. No clear effect of vacuum occurred for the strain range considered. However, the grease coating improved fatigue life. Possible explanations for the observed effects are given, including chemical reaction with the specimen surface, i.e. a Rhebinder effect; a crack-filling effect leading to a decrease in the stress intensity factor; and a reduction in friction along the sliding crack surfaces giving less debris and thereby a lower tensile stress at the crack tip
Keywords :
environmental testing; fatigue cracks; fatigue testing; lead alloys; life testing; shear strength; soldering; tin alloys; 1×10-6 torr; 10Sn90Pb; 300 K; 63Sn37Pb; Pb-Sn solder joints; Rhebinder effect; chemical reaction; crack-filling effect; environmental influence; friction reduction; grease coating; low-cycle fatigue life; materials testing; shear; specimen surface; stress intensity factor; tensile stress; total strain control; vacuum; Capacitive sensors; Chemicals; Coatings; Fatigue; Lead; Life testing; Soldering; Strain control; Surface cracks; Tensile stress;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163972
