Encapsulant for non-hermetic multichip packaging applications

The authors present an encapsulant, study that identifies a robust silicone material suitable for MCP (multichip packaging) applications. In the study, the properties/characteristics of encapsulant needed for MCP applications were identified. A literature survey then led to the selection of six types of encapsulants for a screening test. The encapsulants were tested at 85°C/85% relative humidity with DC bias and in-situ leakage current monitoring. A modified silicone encapsulant (MSE) was identified as the most promising material and was subjected to more in-depth studies. Test samples encapsulated with MSE were exposed to five selected chemicals to study their chemical resistance. The samples were then subjected to a temperature-humidity-bias test. for moisture protection studies in addition, studies such as material formulation, adhesion, mechanical protection, and temperature cycling were conducted