• DocumentCode
    2053804
  • Title

    Oxidation of Silicon Electrochemically Etched Microchannels Arrays

  • Author

    Wu, Junxu ; Wang, Lianwei ; Chen, Xiaoming ; Zheng, Mingjie ; Liu, Weili ; Song, Zhitang ; Sarro, P.M.

  • Author_Institution
    Dept. of Electron. Eng., East China Normal Univ., Shanghai
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    399
  • Lastpage
    402
  • Abstract
    Macroporous silicon technology is an important method to fabricate microchannels on silicon. The formation of insulator layer on the sidewall of the channels is necessary for electrical isolation or passivation of the surface. Oxidation is one of the preferred options. In this paper we investigate the effect of various oxidation processes on the smoothness of the sidewalls of the high aspect ratio macropores. Using thermal oxidation with a combination of dry and wet steps, the shape and structures inside silicon microchannels can be changed after oxidation to certain thickness. To keep the surface inside the microchannels smooth, it is only possible to get oxide layer with limited thickness by oxidation in microchannel if the channel size is very small
  • Keywords
    electrochemistry; etching; microchannel plates; micromechanical devices; porous materials; silicon; surface roughness; Si; electrical isolation; macropores; macroporous silicon technology; microchannel fabrication; oxidation process; silicon microchannnels; surface passivation; thermal oxidation; Contracts; Dielectrics and electrical insulation; Dry etching; Electrochemical processes; Isolation technology; Microchannel; Oxidation; Passivation; Silicon on insulator technology; Systems engineering and theory; macroporous silicon; microchannel; oxidation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334767
  • Filename
    4134979