DocumentCode :
2056219
Title :
A low-cost high-performance CMOS timing vernier for ATE
Author :
Chapman, Jim ; Currin, Jeff ; Payne, Steve
Author_Institution :
Credence Syst. Corp., Fremont, CA, USA
fYear :
1995
fDate :
21-25 Oct 1995
Firstpage :
459
Lastpage :
468
Abstract :
Current conditions within the test industry impose a difficult combination of design requirements for the next generation of General Purpose Automatic Test Equipment: faster devices require higher tester bandwidth, higher data rates, and higher timing edge accuracy; yet, lower device selling prices and industry economics require lower ATE acquistion and maintenance costs. Emitter Coupled Logic (ECL) based timing systems can achieve high performance, but are expensive and power hungry. The use of CMOS-based ATE has become necessary in order to meet the lower-power and higher integration demands associated with lower cost. However methods of dealing with the high variability of a CMOS process and with the high temperature and voltage dependence of CMOS are required. A new timing vernier combining two different stabilization techniques has been developed using a 0.5 micron process which achieves high performance at low power and low cost
Keywords :
CMOS analogue integrated circuits; automatic test equipment; circuit feedback; clocks; delay circuits; integrated circuit noise; jitter; phase locked loops; temperature control; thermal noise; timing circuits; 0.5 micron; 2.5 W; ATE; CMOS timing vernier; DUT; Nbias generation; charge pump; clock generation; delay locked loop feedback system; fine vernier; general purpose tester; integrated differential delay line; low power; low-cost high-performance; phase detector; stabilization techniques; temperature control circuit; temperature regulation system; thermal noise; timing edge generators; timing subsystem; Accuracy; Automatic test equipment; Automatic testing; Bandwidth; CMOS process; Costs; Industrial economics; Power generation economics; Power system economics; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-2992-9
Type :
conf
DOI :
10.1109/TEST.1995.529873
Filename :
529873
Link To Document :
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