• DocumentCode
    2056439
  • Title

    The Effects of Driving Waveform of Piezoelectric Industrial Inkjet Head for Fine Patterns

  • Author

    Kim, Youngjae ; Sim, Wonchul ; Park, Changsung ; Yoo, Youngseuck ; Joung, Jaewoo ; Oh, Yongsoo

  • Author_Institution
    eMD Lab. Central R&D Inst., Suwon
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    826
  • Lastpage
    831
  • Abstract
    This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristics were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(laser doppler vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025N/m, it is possible to eject stable droplets up to 20kHz, 4.4m/s and above 8pL at the different applied driving waveforms.
  • Keywords
    ink jet printers; micromechanical devices; nozzles; piezoelectric transducers; silicon-on-insulator; MEMS process; SOI wafers; actuators; droplet velocity maximization; dynamic signal analyzer; jetting characteristics; laser doppler vibrometer; mechanical design; mechanical simulation; piezoelectric bend mode inkjet; resonance frequency; silicon direct bonding method; surface tension; voltage response; Actuators; Ceramics; Design optimization; Firing; Frequency; Ink; Micromechanical devices; Silicon; Voltage; Wafer bonding; MEMS; droplet; inkjet head; piezoelectric; waveform;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334905
  • Filename
    4135078