Title :
Effects of temperature on DC tracking resistance of organic insulating materials
Author :
Du, B.X. ; Kobayashi, S.
Author_Institution :
Niigata Coll. of Technol., Japan
Abstract :
The tracking that is dielectric breakdown phenomenon of material surface may be generated on organic insulating materials. When this tracking is generated, not only are there problems of the electric appliances and devices, but also it has a strong influence on safety and reliability. Temperature effects on tracking resistance should be investigated due to the increasing usage of organic materials in high temperature environments. This paper presents a study on the DC tracking resistance of organic insulating materials by use of the IEC Publication 112 method. Accordingly, the authors made the high temperature condition laboratory-like, the tracking resistance and scintillation discharge currents on DC tracking test were studied. They found that organic insulating materials could be classified into two types by increasing the temperature. One shows that the tracking resistance becomes too low, the other one shows that the tracking resistance becomes to high. They also found that the effects of temperature on the tracking resistance are different by the discharge energy
Keywords :
discharges (electric); electric current measurement; electric resistance measurement; insulation testing; organic insulating materials; DC tracking resistance; IEC Publication 112 method; dielectric breakdown phenomenon; discharge current measurement; material surface; organic insulating materials; reliability; safety; scintillation discharge currents; temperature effects; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric resistance; Electrical safety; Home appliances; Insulation life; Organic materials; Surface resistance; Temperature;
Conference_Titel :
Electrical Insulating Materials, 2001. (ISEIM 2001). Proceedings of 2001 International Symposium on
Conference_Location :
Himeji
Print_ISBN :
4-88686-053-2
DOI :
10.1109/ISEIM.2001.973684