DocumentCode
2057293
Title
Effects of temperature on DC tracking resistance of organic insulating materials
Author
Du, B.X. ; Kobayashi, S.
Author_Institution
Niigata Coll. of Technol., Japan
fYear
2001
fDate
2001
Firstpage
395
Lastpage
398
Abstract
The tracking that is dielectric breakdown phenomenon of material surface may be generated on organic insulating materials. When this tracking is generated, not only are there problems of the electric appliances and devices, but also it has a strong influence on safety and reliability. Temperature effects on tracking resistance should be investigated due to the increasing usage of organic materials in high temperature environments. This paper presents a study on the DC tracking resistance of organic insulating materials by use of the IEC Publication 112 method. Accordingly, the authors made the high temperature condition laboratory-like, the tracking resistance and scintillation discharge currents on DC tracking test were studied. They found that organic insulating materials could be classified into two types by increasing the temperature. One shows that the tracking resistance becomes too low, the other one shows that the tracking resistance becomes to high. They also found that the effects of temperature on the tracking resistance are different by the discharge energy
Keywords
discharges (electric); electric current measurement; electric resistance measurement; insulation testing; organic insulating materials; DC tracking resistance; IEC Publication 112 method; dielectric breakdown phenomenon; discharge current measurement; material surface; organic insulating materials; reliability; safety; scintillation discharge currents; temperature effects; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric resistance; Electrical safety; Home appliances; Insulation life; Organic materials; Surface resistance; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2001. (ISEIM 2001). Proceedings of 2001 International Symposium on
Conference_Location
Himeji
Print_ISBN
4-88686-053-2
Type
conf
DOI
10.1109/ISEIM.2001.973684
Filename
973684
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