DocumentCode
2057449
Title
Nanofabrication Simulation as a processes research tool
Author
Hagouel, P.I.
Author_Institution
11 Chrysostomou Smyrnis Street, GR-546 22 Thessaloniki, Greece
fYear
2008
fDate
11-14 May 2008
Firstpage
35
Lastpage
41
Abstract
Nanofabrication simulation is evolving continuously. Ever higher and faster digital computer calculating and processing power automates further the algorithms. General simulators can tackle mainstream processes. Special cases call for individualized simulation approach. Information of the physical process and initial conditions of the optical line of positive photoresist on reflective substrate is derived by using the X-ray tracing algorithm that demonstrates initial value starting surface segment widths for etch ray "launching" in the sub Angstrom region; Furthermore, ray-crossing and ray-scarce regions delineate the feed through pathways for the etchant to reach the final profile. In another case, that of exposed cluster of lines in negative resist where the developer [etchant] is heated up, by validating the experimental results via the calibrated simulator, we validate also the initial hypothesis of the physical and chemical processes that come into play such as the thermodynamics of the resist - etchant medium front that produce negative slant angle line walls.
Keywords
etching; nanolithography; photoresists; ray tracing; thermodynamics; X-ray tracing algorithm; chemical processes; digital computer calculation; mainstream processes; nanofabrication simulation; negative slant angle line walls; photoresist; physical processes; process research tool; ray-crossing; ray-scarce regions; reflective substrate; resist-etchant medium; thermodynamics; Chemical processes; Computational modeling; Etching; Feeds; Nanofabrication; Physics; Polymers; Resists; Temperature; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-1881-7
Electronic_ISBN
978-1-4244-1882-4
Type
conf
DOI
10.1109/ICMEL.2008.4559219
Filename
4559219
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