• DocumentCode
    2057449
  • Title

    Nanofabrication Simulation as a processes research tool

  • Author

    Hagouel, P.I.

  • Author_Institution
    11 Chrysostomou Smyrnis Street, GR-546 22 Thessaloniki, Greece
  • fYear
    2008
  • fDate
    11-14 May 2008
  • Firstpage
    35
  • Lastpage
    41
  • Abstract
    Nanofabrication simulation is evolving continuously. Ever higher and faster digital computer calculating and processing power automates further the algorithms. General simulators can tackle mainstream processes. Special cases call for individualized simulation approach. Information of the physical process and initial conditions of the optical line of positive photoresist on reflective substrate is derived by using the X-ray tracing algorithm that demonstrates initial value starting surface segment widths for etch ray "launching" in the sub Angstrom region; Furthermore, ray-crossing and ray-scarce regions delineate the feed through pathways for the etchant to reach the final profile. In another case, that of exposed cluster of lines in negative resist where the developer [etchant] is heated up, by validating the experimental results via the calibrated simulator, we validate also the initial hypothesis of the physical and chemical processes that come into play such as the thermodynamics of the resist - etchant medium front that produce negative slant angle line walls.
  • Keywords
    etching; nanolithography; photoresists; ray tracing; thermodynamics; X-ray tracing algorithm; chemical processes; digital computer calculation; mainstream processes; nanofabrication simulation; negative slant angle line walls; photoresist; physical processes; process research tool; ray-crossing; ray-scarce regions; reflective substrate; resist-etchant medium; thermodynamics; Chemical processes; Computational modeling; Etching; Feeds; Nanofabrication; Physics; Polymers; Resists; Temperature; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2008. MIEL 2008. 26th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-1881-7
  • Electronic_ISBN
    978-1-4244-1882-4
  • Type

    conf

  • DOI
    10.1109/ICMEL.2008.4559219
  • Filename
    4559219