Title :
Compact thermal model of a three-phase IGBT inverter power module
Author :
Zhou, Z. ; Holland, P.M. ; Igic, P.
Author_Institution :
Inst. of Innovation, Swansea Univ., Swansea
Abstract :
A compact thermal model of a three-phase IGBT inverter power module utilised in most of variable speed drivers has been described in this paper. The compact thermal model equals to an electrical RC network model is assembled from thermal resistances and thermal capacitances so that it can be easily implemented in a circuit simulator. Transient thermal 3D finite element (FE) model of the IGBT module has been carried out using commercially available FLOTHERM software; the 3D simulation results are then utilised to extract the compact thermal network parameters of the IGBT power modular. Good agreement has been achieved between simulation and experimental measurement.
Keywords :
insulated gate bipolar transistors; modules; semiconductor device models; thermal resistance; FLOTHERM; thermal 3D finite element model; thermal capacitance; thermal resistance; three-phase IGBT inverter power module; Assembly; Capacitance; Circuit simulation; Diodes; Finite element methods; Insulated gate bipolar transistors; Inverters; Multichip modules; Packaging; Thermal resistance;
Conference_Titel :
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-1881-7
Electronic_ISBN :
978-1-4244-1882-4
DOI :
10.1109/ICMEL.2008.4559249
