Title :
On the thermal inertia of the semiconductor components
Author :
Birca-Galateanu, S.
Author_Institution :
IUFM, Nantes, France
Abstract :
Simple reasoning and relationships are deduced to obtain the semiconductor and heatsink thermal capacitance (inertia) from the data sheets. Thermal capacitance connection in the thermal equivalent circuit is pointed out.
Keywords :
equivalent circuits; heat sinks; power semiconductor switches; thermal management (packaging); heatsink thermal capacitance; semiconductor components; thermal equivalent circuit; thermal inertia; Aluminum; Capacitance; Copper; Isolators; Semiconductor diodes; Surface impedance; Surface resistance; Temperature; Thermal resistance; Voltage;
Conference_Titel :
Signals, Circuits and Systems, 2005. ISSCS 2005. International Symposium on
Print_ISBN :
0-7803-9029-6
DOI :
10.1109/ISSCS.2005.1511309
