DocumentCode
2058259
Title
On the thermal inertia of the semiconductor components
Author
Birca-Galateanu, S.
Author_Institution
IUFM, Nantes, France
Volume
2
fYear
2005
fDate
14-15 July 2005
Firstpage
589
Abstract
Simple reasoning and relationships are deduced to obtain the semiconductor and heatsink thermal capacitance (inertia) from the data sheets. Thermal capacitance connection in the thermal equivalent circuit is pointed out.
Keywords
equivalent circuits; heat sinks; power semiconductor switches; thermal management (packaging); heatsink thermal capacitance; semiconductor components; thermal equivalent circuit; thermal inertia; Aluminum; Capacitance; Copper; Isolators; Semiconductor diodes; Surface impedance; Surface resistance; Temperature; Thermal resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Signals, Circuits and Systems, 2005. ISSCS 2005. International Symposium on
Print_ISBN
0-7803-9029-6
Type
conf
DOI
10.1109/ISSCS.2005.1511309
Filename
1511309
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