DocumentCode
2058356
Title
Mechanical aspects of nanoimprint patterning
Author
Cross, Graham L W ; Connell, Barry O. ; Pethica, John B. ; Oliver, Warren
Author_Institution
SFI Nanosci. Lab., Trinity Coll., Dublin, Ireland
Volume
2
fYear
2003
fDate
12-14 Aug. 2003
Firstpage
494
Abstract
Nanoimprinting is a high resolution, parallel nanopatterning technique where, typically, a rigid stamp is brought into contact with a thin polymer film and pattern transfer achieved by the application of force and heat. The detailed mechanics of the deformation of thin film polymer layers during imprint by simple stamp geometries has not been reported. We report here measurements of various mechanical aspects of the nanoimprint process, including forces during the deformation and mechanical properties of the resultant structures. Master designs were realized in spherical blank indenters by focused ion beam milling. Deformation was measured during displacement and load controlled imprinting by a temperature controlled nanoindenter above and below the glass transition region of the polymer. The role of residual stresses in pattern transfer fidelity for isothermal stamping is shown.
Keywords
creep; glass transition; indentation; internal stresses; milling; nanolithography; polymer films; deformation; fidelity; force application; glass transition; heat application; ion beam milling; isothermal stamping; mechanical aspects; mechanical properties; nanoimprint patterning; nanoindenter; pattern transfer; residual stresses; rigid stamp; spherical blank indenters; stamp geometries; temperature controlled nanoindenter; thin polymer film; Displacement control; Force measurement; Geometry; Heat transfer; Ion beams; Mechanical factors; Mechanical variables measurement; Nanopatterning; Polymer films; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on
Print_ISBN
0-7803-7976-4
Type
conf
DOI
10.1109/NANO.2003.1230954
Filename
1230954
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