Title :
Inductive contamination analysis (ICA) with SRAM application
Author :
Khare, Jitendra ; Maly, Wojciech
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
This paper proposes a new simulation-based fault modeling methodology. The methodology-an extension of Inductive Fault Analysis-uses the contamination-defect-fault simulator CODEF to directly relate effects of process-induced contamination to circuit-level malfunctions. The application of this methodology (called Inductive Contamination Analysis) is demonstrated by development of SRAM fault models
Keywords :
SRAM chips; circuit analysis computing; digital simulation; integrated circuit modelling; integrated circuit testing; CODEF; ICA; SRAM application; circuit-level malfunctions; contamination-defect-fault simulator; fault models; inductive contamination analysis; process-induced contamination; simulation-based fault modeling methodology; Application software; Circuit faults; Circuit simulation; Circuit testing; Computational modeling; Contamination; Independent component analysis; Integrated circuit modeling; Random access memory; Virtual manufacturing;
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2992-9
DOI :
10.1109/TEST.1995.529883
