DocumentCode :
2058936
Title :
Diffusion furnace dopant activation matching through a ramped temperature idle
Author :
Black, Kevin
Author_Institution :
Idaho State Univ., Pocatello, ID
fYear :
2008
fDate :
11-14 May 2008
Firstpage :
281
Lastpage :
282
Abstract :
Significant non-uniform ´time at temperature´ or Dt variation is observed across a horizontal furnace load in diffusion batch processes. Non uniform activation of dopants is observed in 800degC, short duration processes with high mobility dopant species. Dt matching across the furnace is obtained by changing the temperature zone set points at furnace idle prior to pushing and processing a full wafer batch. A ramped idle temperature ranging 120degC across the furnace improves activation uniformity. Boron implanted test wafers show an 85% reduction in activation non uniformity across the furnace when using a ramped idle.
Keywords :
furnaces; integrated circuit testing; monolithic integrated circuits; semiconductor doping; activation uniformity; boron implanted test wafers; diffusion batch processes; diffusion furnace dopant activation matching; ramped temperature idle; time at temperature; uniform activation; Annealing; Boron; Conductivity; Furnaces; Implants; Microelectronics; Rapid thermal processing; Semiconductor device testing; Temperature distribution; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-1881-7
Electronic_ISBN :
978-1-4244-1882-4
Type :
conf
DOI :
10.1109/ICMEL.2008.4559278
Filename :
4559278
Link To Document :
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