DocumentCode
2058936
Title
Diffusion furnace dopant activation matching through a ramped temperature idle
Author
Black, Kevin
Author_Institution
Idaho State Univ., Pocatello, ID
fYear
2008
fDate
11-14 May 2008
Firstpage
281
Lastpage
282
Abstract
Significant non-uniform ´time at temperature´ or Dt variation is observed across a horizontal furnace load in diffusion batch processes. Non uniform activation of dopants is observed in 800degC, short duration processes with high mobility dopant species. Dt matching across the furnace is obtained by changing the temperature zone set points at furnace idle prior to pushing and processing a full wafer batch. A ramped idle temperature ranging 120degC across the furnace improves activation uniformity. Boron implanted test wafers show an 85% reduction in activation non uniformity across the furnace when using a ramped idle.
Keywords
furnaces; integrated circuit testing; monolithic integrated circuits; semiconductor doping; activation uniformity; boron implanted test wafers; diffusion batch processes; diffusion furnace dopant activation matching; ramped temperature idle; time at temperature; uniform activation; Annealing; Boron; Conductivity; Furnaces; Implants; Microelectronics; Rapid thermal processing; Semiconductor device testing; Temperature distribution; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-1881-7
Electronic_ISBN
978-1-4244-1882-4
Type
conf
DOI
10.1109/ICMEL.2008.4559278
Filename
4559278
Link To Document