Title :
MCM compute node thermal failure-design or test problem?
Author :
Sayre, Edward P.
Author_Institution :
North East Syst. Associates Inc., USA
Abstract :
This paper is a unique documentation of a MCM thermal failure due to inadequate signal integrity of the test fixture used for at-speed testing. An accurate SPICE model of the rest fixture and MCM was developed utilizing TDR techniques and analytical representations of the test fixture elements. The SPICE analysis showed clearly that impedance mismatches within the fixture components and MCM carrier and test socket caused a significant increase in the RMS driver current and produced a 33% increase in power dissipation in each MCM I/O driver. The additional dissipation, in conjunction with the elevated temperature test environment caused the thermal failures observed during at-speed testing
Keywords :
SPICE; digital simulation; failure analysis; multichip modules; thermal stresses; time-domain reflectometry; MCM I/O driver; MCM carrier; MCM thermal failure; RMS driver current; SPICE analysis; SPICE model; TDR techniques; analytical representations; at-speed testing; dissipation; fixture components; impedance mismatches; power dissipation; signal integrity; temperature test environment; test fixture elements; test socket; thermal failure; thermal failures; Failure analysis; Fixtures; Impedance; Power dissipation; Production; SPICE; Sockets; System testing; Temperature; Voltage;
Conference_Titel :
Test Conference, 1996. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-3541-4
DOI :
10.1109/TEST.1996.557144
