• DocumentCode
    2059907
  • Title

    Temperature dependence of strain in AlxGa1-xN/GaN heterostructures

  • Author

    Chen, D.J. ; Shen, B. ; Zhang, K.X. ; Tao, Y.Q. ; Wu, X.S. ; Xu, J. ; Zhang, R. ; Zheng, Y.D.

  • Author_Institution
    Jiangsu Provincial Key lab. of Photonic & Electron. Mat. Sci. & Technol., Nanjing Univ., China
  • fYear
    2004
  • fDate
    20-25 Sept. 2004
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    The temperature dependence of strain in a 50-nm- and a 100-nm-thick Al0.2Ga0.8N/GaN heterostructures were investigated at temperatures 300-800 K. The results show that the temperature behavior of the in-plane strain in the 50-nm-thick AlGaN layer is different to that in the 100-nm-thick AlGaN layer. There exists an initial energy barrier to the strain relaxation for the 50-nm-thick Al0.22Ga0.78N/GaN heterostructure. Meanwhile, for both the 50-nm-and 100-nm-thick AlGaN layers the strain relaxation becomes saturated at the high temperature segment, although the temperature at the point of saturation is different. The total strain relaxation is less than 5% for both the 50-nm- and 100-nm-thick Al0.22Ga0.78N layers at whole temperature range in our measurements.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; semiconductor heterojunctions; stress relaxation; wide band gap semiconductors; 100 nm; 300 to 800 K; 50 nm; AlxGa1-xN-GaN; energy barrier; heterostructure strain; high resolution X-ray diffraction; strain relaxation; temperature dependence; Aluminum gallium nitride; Capacitive sensors; Gallium nitride; Laboratories; Lattices; Strain measurement; Temperature dependence; Temperature distribution; Thermal expansion; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconducting and Insulating Materials, 2004. SIMC-XIII-2004. 13th International Conference on
  • Print_ISBN
    0-7803-8668-X
  • Type

    conf

  • DOI
    10.1109/SIM.2005.1511387
  • Filename
    1511387