Hybrid flip-chip integration of a 40 Gb/s DPSK receiver comprising a balanced photodetector on a DLI-SOI board

Author

Unterbörsch, G. ; Kroh, M. ; Honecker, J. ; Steffan, A.G. ; Tsianos, G. ; Bach, H.-G. ; Kreissl, J. ; Kunkel, R. ; Mekonnen, G.G. ; Rehbein, W. ; Schmidt, D. ; Bruns, J. ; Mitze, T. ; Voigt, K. ; Zimmermann, L.

Author_Institution

u2t Photonics AG, Berlin

fYear

2008

fDate

21-25 Sept. 2008

Firstpage

1

Lastpage

2

Abstract

A DPSK receiver concept using flipchip hybrid integration of InP photodetectors on SOI boards with optical decoder is presented. Horizontal waveguiding enables low-cost production for high data rates.

Keywords

III-V semiconductors; decoding; differential phase shift keying; flip-chip devices; hybrid integrated circuits; indium compounds; integrated optoelectronics; light interferometers; optical receivers; optical waveguides; photodetectors; silicon-on-insulator; DLI-SOI board; DPSK receiver; InP; Si-SiO₂; balanced photodetector; bit rate 40 Gbit/s; horizontal waveguiding; hybrid flip-chip integration; optical decoder; Assembly; Decoding; Differential quadrature phase shift keying; Integrated optics; Optical interferometry; Optical modulation; Optical receivers; Optical waveguides; Photodetectors; Silicon on insulator technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Communication, 2008. ECOC 2008. 34th European Conference on

Conference_Location

Brussels

Print_ISBN

978-1-4244-2227-2

Electronic_ISBN

978-1-4244-2228-9

Type

conf

DOI

10.1109/ECOC.2008.4729450

Filename

4729450