Author :
Unterbörsch, G. ; Kroh, M. ; Honecker, J. ; Steffan, A.G. ; Tsianos, G. ; Bach, H.-G. ; Kreissl, J. ; Kunkel, R. ; Mekonnen, G.G. ; Rehbein, W. ; Schmidt, D. ; Bruns, J. ; Mitze, T. ; Voigt, K. ; Zimmermann, L.
Keywords :
III-V semiconductors; decoding; differential phase shift keying; flip-chip devices; hybrid integrated circuits; indium compounds; integrated optoelectronics; light interferometers; optical receivers; optical waveguides; photodetectors; silicon-on-insulator; DLI-SOI board; DPSK receiver; InP; Si-SiO2; balanced photodetector; bit rate 40 Gbit/s; horizontal waveguiding; hybrid flip-chip integration; optical decoder; Assembly; Decoding; Differential quadrature phase shift keying; Integrated optics; Optical interferometry; Optical modulation; Optical receivers; Optical waveguides; Photodetectors; Silicon on insulator technology;