DocumentCode
2060282
Title
Progressive breakdown dynamics in HfSiON/SiON gate stacks
Author
Miranda, E. ; Falbo, P. ; Nafria, M. ; Crupi, F.
Author_Institution
Dept. d´´Eng. Electron., Univ. Autonoma de Barcelona, Barcelona
fYear
2008
fDate
11-14 May 2008
Firstpage
525
Lastpage
528
Abstract
The progressive leakage current growth in electrically stressed HfxSi1-xON/SiON gate stacks is analyzed within the framework of the physics of mesoscopic conducting systems. The breakdown spot is modeled as a nanoconstriction whose effective cross-section area increases as the degradation proceeds. We show that, after eliminating the gate tunneling current component, the post-breakdown conductance exhibits plateaus close to the quantum unit 2e2/h, where e is the electron charge and h the Planck´s constant, as it is expected for atomic-sized contacts.
Keywords
electric breakdown; electrical conductivity; hafnium compounds; high-k dielectric thin films; leakage currents; mesoscopic systems; silicon compounds; tunnelling; HfSiON-SiON; atomic-sized contacts; breakdown dynamics; electrically stressed gate stacks; mesoscopic conducting system; post-breakdown conductance; progressive leakage current; quantum unit; tunneling; Atomic layer deposition; Degradation; Dielectric substrates; Electric breakdown; Electrons; Hafnium; Leakage current; Physics; Stress; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-1881-7
Electronic_ISBN
978-1-4244-1882-4
Type
conf
DOI
10.1109/ICMEL.2008.4559338
Filename
4559338
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