DocumentCode :
2060362
Title :
Characterization of MOS interfaces on protected and un-protected 4H-SiC surfaces
Author :
Lodzinski, M. ; Perez-Tomas, A. ; Guy, O.J. ; Penny, M. ; Batcup, S. ; Al-Hartomy, O.A. ; Dunstan, P. ; Wilks, S. ; Igic, P.
Author_Institution :
Sch. of Eng., Univ. of Wales, Swansea
fYear :
2008
fDate :
11-14 May 2008
Firstpage :
541
Lastpage :
543
Abstract :
In this paper, we present investigations performed on 4H-SiC surfaces annealed at high temperature in the presence of a protective carbon cap and compare these to samples fabricated by the same process, but without a protective layer. The high temperature treatment resulted in sample surfaces with various roughnesses. The annealed samples have been oxidised to fabricate MOS structures in order to investigate the effect of annealing on the physical properties SiO2/SiC interfaces. Structures have been characterized using C-V measurements. Results suggest that treatments to reduce surface roughness caused by annealing, prior to any oxidation, are effective in reducing the density of interface traps. The density of SiO2/SiC interface traps for samples treated prior to oxidation is lower than interface trap densities for annealed samples with no preoxidation roughness reduction treatment.
Keywords :
MOS capacitors; annealing; carbon; high-temperature techniques; oxidation; silicon compounds; surface roughness; C-V measurements; H-SiC; MOS capacitors; MOS interfaces; MOS structures; MOSFET technology; SiO2-SiC; high temperature treatment; interface traps; oxidation; physical properties; protective carbon cap; roughness reduction treatment; surface annealing; surface roughness; Interface states; Oxidation; Plasma temperature; Protection; Rapid thermal annealing; Rough surfaces; Silicon carbide; Surface morphology; Surface roughness; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-1881-7
Electronic_ISBN :
978-1-4244-1882-4
Type :
conf
DOI :
10.1109/ICMEL.2008.4559342
Filename :
4559342
Link To Document :
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