DocumentCode :
2060386
Title :
On the effect of ISSQ testing in reducing early failure rate
Author :
Wallquist, Kenneth M.
Author_Institution :
Philips Semicond., Albuquerque, NM, USA
fYear :
1995
fDate :
21-25 Oct 1995
Firstpage :
910
Lastpage :
915
Abstract :
This paper details results of a year-long study on the effects of ISSQ testing on the reduction of early failure rate (EFR) of microcontrollers. This experiment screened a large quantity of ICs at package testing to a preset ISSQ limit, performed burn-in on all parts, and investigated the effectiveness of ISSQ in removal of infant mortality failures. The ultimate purpose of this study was to determine a suitable ISSQ test limit for wafer sort to ensure a high level of outgoing quality and reliability
Keywords :
CMOS digital integrated circuits; automatic testing; computer testing; failure analysis; integrated circuit reliability; integrated circuit testing; microcontrollers; quality control; CMOS circuits; ISSQ testing; IC screening; burn-in; early failure rate; infant mortality failures; microcontrollers; outgoing quality; package testing; reliability; test limit; wafer sort; Assembly; Circuit testing; Gaussian distribution; Histograms; Measurement standards; Microcontrollers; Packaging; Probability distribution; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-2992-9
Type :
conf
DOI :
10.1109/TEST.1995.529924
Filename :
529924
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2060386
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