Solving known good die (and substrate) test issues

Author

Righter, Alan W.

Author_Institution

Multichip Module Applications Dept., Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1995

fDate

21-25 Oct 1995

Firstpage

916

Abstract

A qualification process for MCM technologies used in military applications does not exist. The opportunities for failure resulting from material interactions in MCM´s will remain if an understanding of failure mechanisms is not taken into account. For example, corrosion and stress voiding (cracking) of metal and interlayer materials is a concern for ICs in a stockpile. More research needs to be conducted in this area for different MCM technologies. Not only does test have to prove out the “known good die” requirement, but the system as a whole needs to be designed to take advantage of the best test strategies available for the particular MCM design technology

Keywords

automatic testing; circuit reliability; failure analysis; multichip modules; production testing; MCM technologies; corrosion; design technology; failure mechanisms; interlayer materials; known good die; qualification process; stress voiding; test issues; test strategies; Circuit testing; Conducting materials; Electronic equipment testing; Failure analysis; Laboratories; Marketing and sales; Probes; Substrates; System testing; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1995. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-2992-9

Type

conf

DOI

10.1109/TEST.1995.529925

Filename

529925