Title :
Solving known good die (and substrate) test issues
Author :
Righter, Alan W.
Author_Institution :
Multichip Module Applications Dept., Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
A qualification process for MCM technologies used in military applications does not exist. The opportunities for failure resulting from material interactions in MCM´s will remain if an understanding of failure mechanisms is not taken into account. For example, corrosion and stress voiding (cracking) of metal and interlayer materials is a concern for ICs in a stockpile. More research needs to be conducted in this area for different MCM technologies. Not only does test have to prove out the “known good die” requirement, but the system as a whole needs to be designed to take advantage of the best test strategies available for the particular MCM design technology
Keywords :
automatic testing; circuit reliability; failure analysis; multichip modules; production testing; MCM technologies; corrosion; design technology; failure mechanisms; interlayer materials; known good die; qualification process; stress voiding; test issues; test strategies; Circuit testing; Conducting materials; Electronic equipment testing; Failure analysis; Laboratories; Marketing and sales; Probes; Substrates; System testing; Voltage;
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2992-9
DOI :
10.1109/TEST.1995.529925
