DocumentCode :
2060404
Title :
Defects and relaxation during the negative bias temperature instability in PMOSFET
Author :
Benard, C. ; Ogier, J.-L. ; Goguenheim, D.
Author_Institution :
ST Microelectron., Rousset Central Characterization Lab., Rousset
fYear :
2008
fDate :
11-14 May 2008
Firstpage :
545
Lastpage :
548
Abstract :
In this paper, several experiments are presented in order to give a complete understanding of relaxation phenomena occurring during Negative Bias Temperature Instabilities (NBTI) stress in PMOSFETs. The impact of electrical field and temperature has been investigated. Firstly, we have proved the impact of the electrical field on de-trapping of oxide traps only, and not on the re-passivation of interface states. Secondly the temperature effects on interface states have been evaluated. Finally, we observe a full relaxation by combining field and high temperature effects. This study allows concluding on relaxation physics due to a NBTI interruption.
Keywords :
MOSFET; electric field effects; stability; PMOSFET; electrical field; negative bias temperature instability; relaxation phenomena; Degradation; Hydrogen; Interface states; MOSFET circuits; Microelectronics; Negative bias temperature instability; Niobium compounds; Stress; Titanium compounds; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-1881-7
Electronic_ISBN :
978-1-4244-1882-4
Type :
conf
DOI :
10.1109/ICMEL.2008.4559343
Filename :
4559343
Link To Document :
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