• DocumentCode
    2060404
  • Title

    Defects and relaxation during the negative bias temperature instability in PMOSFET

  • Author

    Benard, C. ; Ogier, J.-L. ; Goguenheim, D.

  • Author_Institution
    ST Microelectron., Rousset Central Characterization Lab., Rousset
  • fYear
    2008
  • fDate
    11-14 May 2008
  • Firstpage
    545
  • Lastpage
    548
  • Abstract
    In this paper, several experiments are presented in order to give a complete understanding of relaxation phenomena occurring during Negative Bias Temperature Instabilities (NBTI) stress in PMOSFETs. The impact of electrical field and temperature has been investigated. Firstly, we have proved the impact of the electrical field on de-trapping of oxide traps only, and not on the re-passivation of interface states. Secondly the temperature effects on interface states have been evaluated. Finally, we observe a full relaxation by combining field and high temperature effects. This study allows concluding on relaxation physics due to a NBTI interruption.
  • Keywords
    MOSFET; electric field effects; stability; PMOSFET; electrical field; negative bias temperature instability; relaxation phenomena; Degradation; Hydrogen; Interface states; MOSFET circuits; Microelectronics; Negative bias temperature instability; Niobium compounds; Stress; Titanium compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2008. MIEL 2008. 26th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-1881-7
  • Electronic_ISBN
    978-1-4244-1882-4
  • Type

    conf

  • DOI
    10.1109/ICMEL.2008.4559343
  • Filename
    4559343