DocumentCode
2060404
Title
Defects and relaxation during the negative bias temperature instability in PMOSFET
Author
Benard, C. ; Ogier, J.-L. ; Goguenheim, D.
Author_Institution
ST Microelectron., Rousset Central Characterization Lab., Rousset
fYear
2008
fDate
11-14 May 2008
Firstpage
545
Lastpage
548
Abstract
In this paper, several experiments are presented in order to give a complete understanding of relaxation phenomena occurring during Negative Bias Temperature Instabilities (NBTI) stress in PMOSFETs. The impact of electrical field and temperature has been investigated. Firstly, we have proved the impact of the electrical field on de-trapping of oxide traps only, and not on the re-passivation of interface states. Secondly the temperature effects on interface states have been evaluated. Finally, we observe a full relaxation by combining field and high temperature effects. This study allows concluding on relaxation physics due to a NBTI interruption.
Keywords
MOSFET; electric field effects; stability; PMOSFET; electrical field; negative bias temperature instability; relaxation phenomena; Degradation; Hydrogen; Interface states; MOSFET circuits; Microelectronics; Negative bias temperature instability; Niobium compounds; Stress; Titanium compounds; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-1881-7
Electronic_ISBN
978-1-4244-1882-4
Type
conf
DOI
10.1109/ICMEL.2008.4559343
Filename
4559343
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