DocumentCode
2060434
Title
Electrical troubleshooting, diagnostics, and repair of multichip modules
Author
Keezer, D.C.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1995
fDate
21-25 Oct 1995
Firstpage
917
Abstract
Discusses techniques for detecting and diagnosing interconnect faults in MCM substrates. The methods use stimuli to measure the attenuation and phase variations resulting from interconnect defects such as opens, shorts and high resistance connections. The processes are compared to alternative techniques and provide better resolution in resistance measurement
Keywords
automatic testing; fault diagnosis; integrated circuit interconnections; multichip modules; MCM substrates; attenuation; diagnostics; high resistance connections; interconnect faults; multichip modules; opens; phase variations; repair; resistance measurement; shorts; troubleshooting; Automatic testing; Bonding; Conferences; Costs; Electrical resistance measurement; Isolation technology; Multichip modules; Optical imaging; Probes; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1995. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-2992-9
Type
conf
DOI
10.1109/TEST.1995.529926
Filename
529926
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