Title :
Electrical troubleshooting, diagnostics, and repair of multichip modules
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Discusses techniques for detecting and diagnosing interconnect faults in MCM substrates. The methods use stimuli to measure the attenuation and phase variations resulting from interconnect defects such as opens, shorts and high resistance connections. The processes are compared to alternative techniques and provide better resolution in resistance measurement
Keywords :
automatic testing; fault diagnosis; integrated circuit interconnections; multichip modules; MCM substrates; attenuation; diagnostics; high resistance connections; interconnect faults; multichip modules; opens; phase variations; repair; resistance measurement; shorts; troubleshooting; Automatic testing; Bonding; Conferences; Costs; Electrical resistance measurement; Isolation technology; Multichip modules; Optical imaging; Probes; Scanning electron microscopy;
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2992-9
DOI :
10.1109/TEST.1995.529926
