DocumentCode
2060627
Title
What´s so different about deep-submicron test?
Author
Hunter, Craig
Author_Institution
Somerset Design Centre, Motorola Inc., Austin, TX, USA
fYear
1995
fDate
21-25 Oct 1995
Firstpage
924
Abstract
Functional verification of products is attetmpting to prove the absence of logical defects in a design, while test is attempting to prove the absence of physical defects in the same design. Both have many common needs; both are critical to the design and development of our products. Validating the state of a device or product has become all but impossible, without direct access to the internal state of the device. Scan based diagnostic techniques are now being used at the board, system and software debug and development stages of product development cycles; these are the same requirements that device test has always had. The implication is to enable the use of on-chip test structures and features for more than just the manufacturing process. As these on-chip features become more prevalent, their standardization and proliferation will be the norm rather than the exception. As such, advancements in diagnostics and built-in self verifying (and testing) devices and products, can and will become the dominant strategy optimizing time to market of our products, ultimately allowing our customers to becomes more successful
Keywords
automatic testing; built-in self test; design for testability; integrated circuit testing; logic testing; production testing; standardisation; built-in self verifying; deep-submicron test; diagnostics; functional verification; logical defects; on-chip test structures; physical defects; product development; scan based diagnostic techniques; software debugging; standardization; time to market; Automatic testing; Logic testing; Manufacturing processes; Product development; Software debugging; Software systems; Software testing; Standardization; System testing; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1995. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-2992-9
Type
conf
DOI
10.1109/TEST.1995.529933
Filename
529933
Link To Document