• DocumentCode
    2060679
  • Title

    A novel technology for thermal control for ISP module for space applications

  • Author

    Monti, Riccardo ; Barboni, Renato ; Gasbarri, Paolo ; Lecci, Umberto ; Zumpano, Marco

  • Author_Institution
    Dept. of Astronaut. & Aerosp. Eng., Univ. of Rome La Sapienza, Rome, Italy
  • fYear
    2010
  • fDate
    6-13 March 2010
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Thermal control is one of the most important themes in space package technology such as Integrated Sub-system Package technology. At present the technical solutions reducing heat stagnation are thermal dissipation and thermal cooling. In this paper a novel approach to increase thermal dissipation, based on the use of the pyroelectric materials, is proposed. The pyroelectric materials are able to convert the thermal energy into electric energy spontaneously. This characteristic is employed to increase thermal flux inside the microelectronic units and to reduce the thermal overstocking. In order to evaluate the temperature distribution inside the component a numerical evaluation of the transient thermal problem inside a multi-layered wall electronic device is performed and a preliminary design of an adaptive dissipation device based on pyroelectric material is presented.
  • Keywords
    aerospace engineering; cooling; integrated circuit packaging; pyroelectricity; temperature control; temperature distribution; thermal management (packaging); ISP module; adaptive dissipation device; electric energy; heat stagnation; integrated sub-system package technology; microelectronic units; multilayered wall electronic device; pyroelectric materials; space applications; space package technology; temperature distribution; thermal control; thermal cooling; thermal dissipation; thermal energy; thermal flux; thermal overstocking; transient thermal problem; Aerospace engineering; Conducting materials; Cooling; Electronic components; Electronic packaging thermal management; Microelectronics; Pyroelectricity; Space technology; Temperature distribution; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2010 IEEE
  • Conference_Location
    Big Sky, MT
  • ISSN
    1095-323X
  • Print_ISBN
    978-1-4244-3887-7
  • Electronic_ISBN
    1095-323X
  • Type

    conf

  • DOI
    10.1109/AERO.2010.5446721
  • Filename
    5446721