• DocumentCode
    2061163
  • Title

    Thermal Effects on Current Mirrors for High Speed Op Amps in Dielectrically Isolated Technology

  • Author

    Hossain, Md M. ; Peng, Mingsheng ; Davis, W. Alan ; Russell, Howard T., Jr. ; Carter, Ronald L.

  • Author_Institution
    Univ. of Texas, Arlington
  • fYear
    2007
  • fDate
    20-22 April 2007
  • Firstpage
    445
  • Lastpage
    448
  • Abstract
    Thermal effects on current mirror performance are significant. It is especially important to consider the thermal effects for current mirrors designed with dielectrically isolated bipolar devices. Thermal effects in integrated circuits can be categorized as thermal coupling, self-heating and the package thermal effect. This paper describes the effect of the self-heating on the output characteristics of the current mirrors. In general all the frequently used current mirrors in analog IC design are simulated and measured with the dielectrically isolated self-heating vertical bipolar inter-company (VBIC) devices. In a step by step procedure it is shown that this thermal effect is reduced or can be made negligible for the advanced mirrors; i.e. for the cascode connected and Wilson current mirrors.
  • Keywords
    bipolar analogue integrated circuits; current mirrors; integrated circuit design; operational amplifiers; VBIC; analog IC design; current mirror; dielectrically isolated bipolar device; high speed op amp; integrated circuits; package thermal effect; self-heating; thermal coupling; thermal effects; vertical bipolar intercompany device; Analog integrated circuits; Bipolar integrated circuits; Coupling circuits; Dielectric devices; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit technology; Isolation technology; Mirrors; Operational amplifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Region 5 Technical Conference, 2007 IEEE
  • Conference_Location
    Fayetteville, AR
  • Print_ISBN
    978-1-4244-1280-8
  • Electronic_ISBN
    978-1-4244-1280-8
  • Type

    conf

  • DOI
    10.1109/TPSD.2007.4380405
  • Filename
    4380405