DocumentCode
2061163
Title
Thermal Effects on Current Mirrors for High Speed Op Amps in Dielectrically Isolated Technology
Author
Hossain, Md M. ; Peng, Mingsheng ; Davis, W. Alan ; Russell, Howard T., Jr. ; Carter, Ronald L.
Author_Institution
Univ. of Texas, Arlington
fYear
2007
fDate
20-22 April 2007
Firstpage
445
Lastpage
448
Abstract
Thermal effects on current mirror performance are significant. It is especially important to consider the thermal effects for current mirrors designed with dielectrically isolated bipolar devices. Thermal effects in integrated circuits can be categorized as thermal coupling, self-heating and the package thermal effect. This paper describes the effect of the self-heating on the output characteristics of the current mirrors. In general all the frequently used current mirrors in analog IC design are simulated and measured with the dielectrically isolated self-heating vertical bipolar inter-company (VBIC) devices. In a step by step procedure it is shown that this thermal effect is reduced or can be made negligible for the advanced mirrors; i.e. for the cascode connected and Wilson current mirrors.
Keywords
bipolar analogue integrated circuits; current mirrors; integrated circuit design; operational amplifiers; VBIC; analog IC design; current mirror; dielectrically isolated bipolar device; high speed op amp; integrated circuits; package thermal effect; self-heating; thermal coupling; thermal effects; vertical bipolar intercompany device; Analog integrated circuits; Bipolar integrated circuits; Coupling circuits; Dielectric devices; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit technology; Isolation technology; Mirrors; Operational amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Region 5 Technical Conference, 2007 IEEE
Conference_Location
Fayetteville, AR
Print_ISBN
978-1-4244-1280-8
Electronic_ISBN
978-1-4244-1280-8
Type
conf
DOI
10.1109/TPSD.2007.4380405
Filename
4380405
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