• DocumentCode
    2061496
  • Title

    Mission optimization and tradeoffs of using SiGe based electronics for a cryogenic environment rover mission

  • Author

    Kegege, O. ; Barlow, M. ; Mantooth, A. ; Ulrich, R.

  • Author_Institution
    Univ. of Arkansas, Fayetteville, AR, USA
  • fYear
    2010
  • fDate
    6-13 March 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Electronics onboard rovers and spacecrafts are kept at approximately 20°C by using radioisotope heater units (RHU), mechanically pumped fluid loops (MPFL), and centralized warm boxes. These thermal control mechanisms add weight and volume of payload, adding to limitations on the number of science instruments that can be accommodated in a space mission. The University of Arkansas together with partnering universities and industry have designed various radiation-hardened silicon germanium (SiGe) based electronics modules and systems that can be used to build spacecraft instruments, robotics components, life support electronics components, and other application-specific integrated circuits (ASICs) for space. These low temperature electronics that can withstand space radiation and thermal cycling would reduce cost, weight, and increase the number of instruments on the payload, hence more science data. In this paper, we evaluate mission optimization, reliability, benefits/cost, and tradeoffs of using SiGe based electronics and systems for cryogenic planetary surface exploration. Also, we analyze components that can be built using SiGe based electronics and show a quantitative impact to a manned planetary surface exploration mission.
  • Keywords
    Ge-Si alloys; cryogenic electronics; planetary rovers; radiation hardening (electronics); space vehicle electronics; SiGe; application-specific integrated circuits; cryogenic environment rover mission; electronics modules; life support electronics components; low temperature electronics; mechanically pumped fluid loops; mission optimization; radiation-hardened silicon germanium; radioisotope heater units; robotics components; space mission; spacecraft instruments; spacecrafts; thermal control mechanism; Aerospace electronics; Cryogenics; Germanium silicon alloys; Heat pumps; Instruments; Payloads; Radioactive materials; Silicon germanium; Space heating; Space vehicles; Reduction in cost; SiGe electronics; mission analysis; optimization; power consumption; weight;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2010 IEEE
  • Conference_Location
    Big Sky, MT
  • ISSN
    1095-323X
  • Print_ISBN
    978-1-4244-3887-7
  • Electronic_ISBN
    1095-323X
  • Type

    conf

  • DOI
    10.1109/AERO.2010.5446757
  • Filename
    5446757