DocumentCode :
2061683
Title :
5.5 A forward-body-bias tuned 450MHz Gm-C 3rd-order low-pass filter in 28nm UTBB FD-SOI with >1dBVp IIP3 over a 0.7-to-1V supply
Author :
Lechevallier, Joeri ; Struiksma, Remko ; Sherry, Hani ; Cathelin, Andreia ; Klumperink, Eric ; Nauta, Bram
Author_Institution :
Univ. of Twente, Enschede, Netherlands
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
Due to the absence of internal nodes, inverter-based Gm-C filters [1,2] allow achieving bandwidths beyond what is possible with opamp-RC techniques. The class-AB behavior of the inverter, together with the high transconductance for a given quiescent current, results in a high dynamic range for a given power consumption when optimally biased [3]. The major disadvantage of traditional inverter-based Gm-C filters is that they are tuned with the supply voltage, VDD, and hence require a finely controllable supply. Voltage regulators used to accomplish this require a voltage headroom (including margin for tuning) and degrade total power efficiency by tens of percent. In this paper, we show that by exploiting body biasing in an ultra-thin buried oxide (BOX) and body, fully-depleted SOI (UTBB FD-SOI) CMOS technology, we overcome the requirement for a tunable VDD in inverter-based Gm-C filters, while achieving high linearity over a wide supply voltage range.
Keywords :
CMOS integrated circuits; invertors; low-pass filters; silicon-on-insulator; voltage regulators; BOX; Gm-C 3rd-order low-pass filter; UTBB FD-SOI CMOS technology; body biasing; body fully-depleted SOI CMOS technology; class-AB behavior; dynamic range; finely controllable supply; frequency 450 MHz; inverter-based Gm-C filters; opamp-RC techniques; power consumption; size 28 nm; supply voltage; total power efficiency; transconductance; ultra-thin buried oxide; voltage 0.7 V to 1 V; voltage headroom; voltage regulators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7062943
Filename :
7062943
Link To Document :
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