DocumentCode
2062162
Title
Capacitive leadframe testing
Author
Turner, Ted T.
Author_Institution
Manuf. Test Div., Hewlett-Packard Co., USA
fYear
1996
fDate
20-25 Oct 1996
Firstpage
925
Abstract
Reliable pin-level diagnosis of open solder joints allows manufacturers to tune SMT process for maximum output. Repair time and repair-induced damage are both significantly reduced with pin-level diagnostics. Detection of misoriented capacitors prevents expensive and reputation-damaging field failures. Ability to test both sides of PCBs allows maximum fault coverage
Keywords
circuit reliability; fault diagnosis; printed circuit testing; production testing; surface mount technology; PCB; SMT process; capacitive leadframe testing; fault coverage; field failures; misoriented capacitors; open solder joints; reliable pin-level diagnosis; repair time; repair-induced damage; Capacitors; Circuit faults; Circuit testing; Connectors; Fixtures; Lead; Life testing; Manufacturing; Soldering; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1996. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-3541-4
Type
conf
DOI
10.1109/TEST.1996.557155
Filename
557155
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