• DocumentCode
    2063686
  • Title

    14.6 An all-digital power-delivery monitor for analysis of a 28nm dual-core ARM Cortex-A57 cluster

  • Author

    Whatmough, Paul N. ; Das, Shidhartha ; Hadjilambrou, Zacharias ; Bull, David M.

  • Author_Institution
    ARM, Cambridge, UK
  • fYear
    2015
  • fDate
    22-26 Feb. 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The current trend for System-on-Chip (SoC) compute subsystems is to improve energy efficiency, while operating at a similar power budget as previous generations. Reduced supply voltages and increased transistor density affords SoCs composed of multiple clusters of CPUs and additional specialized compute engines. However, this comes at the cost of both increasing current, and increasing current density, to the extent that these systems are ultimately constrained by power delivery. Pathological AC supply noise conditions may arise due to sporadic combinations of system and micro-architectural events, and these effectively limit the energy efficiency of the system, as sufficient voltage margin must be deployed to guarantee these conditions do not result in system failure.
  • Keywords
    flip-chip devices; low-power electronics; system-on-chip; SoC; all-digital power-delivery monitor; current density; dual-core ARM Cortex-A57 cluster; energy efficiency; power delivery; reduced supply voltages; size 28 nm; system-on-chip; transistor density; voltage margin; Current measurement; Monitoring; Noise; Radiation detectors; System-on-chip; Voltage measurement; Voltage-controlled oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4799-6223-5
  • Type

    conf

  • DOI
    10.1109/ISSCC.2015.7063026
  • Filename
    7063026