• DocumentCode
    2063837
  • Title

    A thermal-aware mapping algorithm for 3D Mesh Network-on-Chip architecture

  • Author

    Gui Feng ; Fen Ge ; Shuang Yu ; Ning Wu

  • Author_Institution
    Coll. of Electron. & Inf. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we present a thermal-aware mapping algorithm based on genetic algorithm that automatically maps IP cores onto 3D Mesh Network-on-Chip (NoC) architecture, which mainly takes the temperature deviation into account. In order to verify the efficiency of the algorithm, we applied our algorithm on various multimedia benchmark applications, and evaluated the performance and temperature with Nirgam and HotSpot. The result shows that, the deviation of temperature between nodes is reduced by 35% on average in our algorithm compared with random mapping, and the peak temperature is reduced by 13% on average, such that the elimination of hotspots and equilibrium of temperature are achieved with better performance.
  • Keywords
    circuit optimisation; genetic algorithms; network-on-chip; thermal engineering; three-dimensional integrated circuits; 3D mesh network-on-chip architecture; HotSpot; IP cores; Nirgam; NoC; genetic algorithm; random mapping; temperature deviation; thermal-aware mapping algorithm; Algorithm design and analysis; Benchmark testing; Biological cells; Genetic algorithms; IP networks; Power demand; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811834
  • Filename
    6811834