DocumentCode
2063837
Title
A thermal-aware mapping algorithm for 3D Mesh Network-on-Chip architecture
Author
Gui Feng ; Fen Ge ; Shuang Yu ; Ning Wu
Author_Institution
Coll. of Electron. & Inf. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
fYear
2013
fDate
28-31 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
In this paper, we present a thermal-aware mapping algorithm based on genetic algorithm that automatically maps IP cores onto 3D Mesh Network-on-Chip (NoC) architecture, which mainly takes the temperature deviation into account. In order to verify the efficiency of the algorithm, we applied our algorithm on various multimedia benchmark applications, and evaluated the performance and temperature with Nirgam and HotSpot. The result shows that, the deviation of temperature between nodes is reduced by 35% on average in our algorithm compared with random mapping, and the peak temperature is reduced by 13% on average, such that the elimination of hotspots and equilibrium of temperature are achieved with better performance.
Keywords
circuit optimisation; genetic algorithms; network-on-chip; thermal engineering; three-dimensional integrated circuits; 3D mesh network-on-chip architecture; HotSpot; IP cores; Nirgam; NoC; genetic algorithm; random mapping; temperature deviation; thermal-aware mapping algorithm; Algorithm design and analysis; Benchmark testing; Biological cells; Genetic algorithms; IP networks; Power demand; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location
Shenzhen
ISSN
2162-7541
Print_ISBN
978-1-4673-6415-7
Type
conf
DOI
10.1109/ASICON.2013.6811834
Filename
6811834
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