Dependence of thermal resistance on ambient and actual temperature

Author

Paasschens, J.C.J. ; Harmsma, S. ; van der Toorn, Ramses

Author_Institution

Philips Res. Labs., Eindhoven, Netherlands

fYear

2004

fDate

13-14 Sept. 2004

Firstpage

96

Lastpage

99

Abstract

We investigate the temperature dependence of thermal resistance. We extract the thermal resistance as a function of ambient temperature. The increase of thermal resistance due to self-heating leads to a non-linear relation between temperature and power dissipation. We show how to implement this in a compact model and what its effect is on simulations at high power dissipation.

Keywords

semiconductor device models; thermal analysis; thermal conductivity; thermal resistance; thermal resistance measurement; compact models; high power dissipation simulations; self-heating; temperature/power dissipation nonlinear relationship; thermal conductivity; thermal resistance actual temperature dependence; thermal resistance ambient temperature dependence; thermal resistance extraction; thermal runaway; Electrical resistance measurement; Gallium arsenide; Heat sinks; Modems; Power dissipation; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal resistance; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting

Print_ISBN

0-7803-8618-3

Type

conf

DOI

10.1109/BIPOL.2004.1365754

Filename

1365754