Title :
A unified multi-axial sub-micron fatigue tester with applications to electronic packaging materials
Author :
Lu, Minfu ; Ren, Wei ; Liu, Sheng ; Shangguan, Dongkai
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
A recently developed multi-axial sub-micron thermomechanical fatigue tester has been used for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. Materials tested include a copper wire, polycarbonate and polyimide films and a lead-free solder alloy. An active alignment monitoring and adjustment has been found to be important for realistic characteristics of tiny points
Keywords :
fatigue testing; packaging; polymer films; reliability; soldering; active alignment monitoring; electronic packaging materials; lead-free solder alloy; multi-axial sub-micron fatigue tester; polycarbonate films; polyimide films; thermomechanical fatigue; Copper; Electronic equipment testing; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Materials testing; Polyimides; Thermomechanical processes; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606159
