IC failure analysis tools and techniques-magic, mystery, and science

Author

Soden, Jerry M. ; Anderson, Richard E. ; Henderson, Christopher L.

Author_Institution

Failure Anal. Dept., Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1996

fDate

20-25 Oct 1996

Firstpage

935

Abstract

This review includes a discussion of the advances being made to meet the challenges presented by state-of-the-art IC and packaging technologies, since these provide the motivation and direction for the future of FA. New capabilities are required for ICs with features such as additional interconnection layers, power distribution planes, or flip chip packaging that reduce or prevent the use of conventional methods without destructive deprocessing. To support improved time to market and yield enhancement, the industry needs diagnostic techniques that provide logical and physical localization in real time during production testing

Keywords

failure analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; integrated circuit yield; production testing; IC failure analysis; diagnostic techniques; failure analysis tools; flip chip packaging; interconnection layers; packaging technologies; power distribution planes; production testing; time to market; yield enhancement; Atomic force microscopy; Electron beams; Electron optics; Failure analysis; Integrated circuit packaging; Integrated circuit testing; Laboratories; Optical microscopy; Photonic integrated circuits; Probes;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1996. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-3541-4

Type

conf

DOI

10.1109/TEST.1996.557164

Filename

557164