DocumentCode
2064741
Title
A 5kV ESD-protected 2.4GHz PA in 180nm RFCMOS optimized by ESD-PA co-design technique
Author
Zitao Shi ; Xin Wang ; Wang, Aiping ; Yuhua Cheng
Author_Institution
Marvell Tech. Group Ltd., Shanghai, China
fYear
2013
fDate
28-31 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
Electrostatic discharge (ESD) protection is required for all ICs. However, ESD protection inevitably introduce parasitic effects that will negatively affect IC performance, especially for parasitic-sensitive radio-frequency (RF) ICs. This paper reports design optimization of a 2.4GHz power amplifier (PA) circuit with 5kB full-chip ESD protection designed in an 180nm commercial RFCMOS technology. The PA design splits confirm that even an optimized ESD protection structure will affect PA circuit performance, which can be substantially recovered by careful PA-ESD co-design consideration.
Keywords
CMOS analogue integrated circuits; UHF integrated circuits; UHF power amplifiers; electrostatic discharge; integrated circuit design; ESD-PA co-design technique; ESD-protected PA circuit; RFIC; commercial RFCMOS technology; electrostatic discharge protection; frequency 2.4 GHz; full-chip ESD protection; parasitic effects; parasitic-sensitive radio-frequency IC; power amplifier circuit; size 180 nm; voltage 5 kV; Circuit optimization; Degradation; Design optimization; Electrostatic discharges; Integrated circuit modeling; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location
Shenzhen
ISSN
2162-7541
Print_ISBN
978-1-4673-6415-7
Type
conf
DOI
10.1109/ASICON.2013.6811874
Filename
6811874
Link To Document