DocumentCode :
2064761
Title :
Advanced Si and SiGe strained channel NMOS and PMOS transistors with high-k/metal-gate stack
Author :
Datta, Suman ; Brask, Justin ; Dewey, Gilbert ; Doczy, Mark ; Doyle, Brian ; Ben Jin ; Kavalieros, Jack ; Metz, Matthew ; Majumdar, Amlan ; Radosavljevic, Marko ; Chau, R.
Author_Institution :
Components Res., Intel Corp., Hillsboro, OR, USA
fYear :
2004
fDate :
13-14 Sept. 2004
Firstpage :
194
Lastpage :
197
Abstract :
Sustaining Moore´s Law of scaling Si CMOS transistors requires not only shrinking the transistor dimensions, but also the introduction of new materials and structures. In the future, advanced high performance CMOS transistors are likely to incorporate highly strained Si and SiGe channels for enhanced carrier transport and high-k/metal-gate stacks for low gate leakage. This work describes the recent advances made in integrating strained Si and SiGe channel transistors with high-k/metal-gate stacks for future high performance, low power logic applications.
Keywords :
Ge-Si alloys; MOSFET; dielectric thin films; electron mobility; elemental semiconductors; hole mobility; internal stresses; leakage currents; semiconductor materials; silicon; CMOS transistor scaling; HfO2-TiN; Si; SiGe; biaxial tensile strain; carrier transport; compressively strained channel; electron mobility; high-k/metal-gate stacks; highly strained channels; hole mobility; low gate leakage; low power logic; strained channel NMOS transistors; strained channel PMOS transistors; transistor dimension shrinking; Gate leakage; Germanium silicon alloys; High K dielectric materials; High-K gate dielectrics; Logic; MOS devices; MOSFETs; Moore´s Law; Silicon germanium; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting
Print_ISBN :
0-7803-8618-3
Type :
conf
DOI :
10.1109/BIPOL.2004.1365778
Filename :
1365778
Link To Document :
بازگشت