Title :
An adaptive Q factor tuning and input impedance matching method for ultra-low power front end of UHF RFID tag
Author :
Chong Huang ; Xiaochen Gu ; Lei Cai ; Cong Li ; Dun Yan ; Bingbing Zhang ; Qin Qin ; Hongyi Wang ; Jiancheng Li
Author_Institution :
UNICORETECH Ltd., China
Abstract :
This paper presents a high conversion coefficient RF front end of an ultra-low power RFID tag, and proposes a new method of more efficient adaptive Q factor tuning and input impedance matching. The Q factor adaptive tuning method makes the front end easier to wake up with limited power, and the adaptive matching method makes the power transmission from antenna to chip more efficient. The conversion block adopts a proposed top structure with a high efficient CMOS differential cross-couple rectifier followed by a high voltage gain charge-pump (CP), which realized high power convert coefficient and high voltage gain. The chip is fabricated in 0.18 um standard CMOS process, whose size is 0.7 × 0.75 mm2. The result shows the sensitivity of new top block is about -15 dBm and 5 dBm when with and without Q factor tuning and input impedance matching technology respectively for parallel parasitical capacitance at input interface, which is rather lower than the sensitivity of tag from market(-10 dBm).
Keywords :
CMOS integrated circuits; Q-factor; UHF integrated circuits; circuit tuning; impedance matching; low-power electronics; radiofrequency identification; CP; Q factor adaptive tuning method; antenna; high conversion coefficient RF front end; high efficient CMOS differential cross-couple rectifier; high voltage gain charge-pump; input impedance matching method; parallel parasitical capacitance; power conversion coefficient; power transmission; size 0.18 mum; standard CMOS process; ultralow power UHF RFID tag; ultralow power front end; Boosting; Capacitance; Q-factor; Radio frequency; Radiofrequency identification; Rectifiers; Tuning; UHF RFID tag; adaptive matching; adaptive tuning; high conversion coefficient; new structure rectifier;
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-6415-7
DOI :
10.1109/ASICON.2013.6811878