DocumentCode :
2065003
Title :
20.6 Electromagnetic vibration energy harvester interface IC with conduction-angle-controlled maximum-power-point tracking and harvesting efficiencies of up to 90%
Author :
Leicht, Joachim ; Amayreh, Mohammad ; Moranz, Christian ; Maurath, Dominic ; Hehn, Thorsten ; Marioli, Yiannos
Author_Institution :
IMTEK, Univ. of Freiburg, Freiburg, Germany
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
An electromagnetic vibration energy harvester (EMH) is an electromechanical mass-spring-damper system transducing electrical energy out of ambient vibrations. Resistive load matching [1] as well as maximum power point (MPP) AC-DC conversion [2] are highly suitable techniques for enhancing the electrical energy output of an EMH. The presented interface IC (Fig. 20.6.1) enables MPP AC-DC conversion by tracking the optimum conduction angle and by employing a hysteretic input voltage controlled inductive DC-DC boost converter. All control signals are derived from the harvester voltage itself. Thus, no additional sensor, harvester disconnection, or DC-DC converter duty-cycle control are needed. Additionally, the implemented voltage conditioning provides over-voltage protection (OVP) and application voltage regulation (VR).
Keywords :
AC-DC power convertors; energy harvesting; maximum power point trackers; shock absorbers; vibration control; vibrations; voltage control; AC-DC conversion; DC-DC converter duty-cycle control; application voltage regulation; conduction-angle-controlled maximum-power-point harvesting; conduction-angle-controlled maximum-power-point tracking; electromagnetic vibration energy harvester interface IC; electromechanical mass-spring-damper system; hysteretic input voltage controlled inductive DC-DC boost converter; optimum conduction angle; over-voltage protection; resistive load matching; voltage conditioning; Energy harvesting; Integrated circuits; Maximum power point trackers; Solid state circuits; Vibrations; Voltage control; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7063079
Filename :
7063079
Link To Document :
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