• DocumentCode
    2065123
  • Title

    Design of novel high speed dual-modulus prescaler based on new optimized structure

  • Author

    Zheng Sun ; Yong Xu ; Chen Hu ; Guangyan Ma ; Yuanliang Wu ; Ying Huang

  • Author_Institution
    Inst. of Commun. Eng., PLA UST, Nanjing, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A kind of novel method is discussed to design the high speed prescaler in GHz frequency-hopping PLL frequency synthesizer. The structure of the dual-modulus prescaler (DMP) is optimized and a novel high speed D-latch integrated with multiple-input OR gate is used. The improved structure can make all separated logic gates be integrated with correlative D flip-flops completely. The circuit can work stably and accurately under all kinds of simulation condition such as different process corners. It is fabricated in 0.18μm mixed-signal CMOS technology. The measured results show that the high speed prscaler ´s operating frequency range is 2.25~ 2.75GHz in 1.8V power supply, the current consumption is 5.4mA (including buffer) and higher speed and lower power dissipation are obtained.
  • Keywords
    CMOS integrated circuits; UHF integrated circuits; circuit optimisation; flip-flops; frequency synthesizers; logic design; logic gates; low-power electronics; mixed analogue-digital integrated circuits; phase locked loops; prescalers; GHz frequency-hopping PLL frequency synthesizer; correlative D flip-flops; current 5.4 mA; current consumption; frequency 2.25 GHz to 2.75 GHz; high speed D-latch; high speed dual-modulus prescaler; logic gates; mixed-signal CMOS technology; multiple-input OR gate; optimized structure; power dissipation; size 0.18 micron; voltage 1.8 V; CMOS integrated circuits; CMOS technology; Flip-flops; Frequency conversion; Frequency synthesizers; Logic gates; Phase locked loops; Current-Mode Logic (CML); DMP; High Speed D-latch; PLL;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811890
  • Filename
    6811890