DocumentCode :
2065149
Title :
The key to concurrent engineering is design tools
Author :
Simpson, William R.
Author_Institution :
Inst. for Defense Anal., Alexandria, VA, USA
fYear :
1996
fDate :
20-25 Oct 1996
Firstpage :
937
Abstract :
The dream of concurrent engineering has been largely unfulfilled. We have made strides in a limited subset of concurrent practices, such as design and manufacturing, but have not been able to fully integrate all aspects of a products life cycle. We still essentially engineer the support package as an after-the-fact product and designers and manufacturers worry primarily about time-to-market. Yet it is clear that given some level of test capability requirement there are ways to reduce the cost of providing that test capability in the overall life-cycle. Test capability includes manufacture, product assurance and field service. Design for testability is a passive set of design rules applied to a design. A more robust approach would be a pro-active analysis of testability factors. Yet our tools are not capable of linking this pro-active approach to CAD representations. Recreating information is an expensive luxury we can no longer afford, yet standard formats for data representations are too numerous to use properly. Further, our CAD tools do not provide the slots and facets for data that can be developed over the product life cycle and introduced as value-added to the design representation
Keywords :
concurrent engineering; design for testability; production testing; quality control; CAD representations; concurrent engineering; design for testability; design representation; design tools; field service; overall life-cycle; pro-active analysis; product assurance; product life cycle; test capability requirement; testability factors; Concurrent engineering; Costs; Design automation; Design engineering; Design for testability; Life testing; Manufacturing; Packaging; Product design; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1996. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-3541-4
Type :
conf
DOI :
10.1109/TEST.1996.557166
Filename :
557166
Link To Document :
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