DocumentCode :
2065291
Title :
21.4 A microfluidic-CMOS platform with 3D capacitive sensor and fully integrated transceiver IC for palmtop dielectric spectroscopy
Author :
Bakhshiani, Mehran ; Suster, Michael A. ; Mohseni, Pedram
Author_Institution :
Case Western Reserve Univ., Cleveland, OH, USA
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
Quantitative measurement of the complex relative dielectric permittivity (εr) of a material vs. frequency (i.e., dielectric spectroscopy, or DS) is a powerful monitoring technique that extracts key information on molecular characteristics of the material-under-test (MUT) via its interactions with electromagnetic waves in a broad frequency range. Despite its potential as a label-free, nondestructive, real-time and fully electrical monitoring modality for myriad applications, including structural biology, fermentation monitoring for alcoholic beverages, food safety control and clinical diagnostics, DS is still underutilized as an analytic tool in scientific research or clinical settings. This is due to the dearth of an autonomous, small-sized, low-power and portable instrument to conduct MHz-to-GHz DS measurements without requiring a microwave probe station, benchtop vector network analyzer (VNA) equipment, or large (100´s of ml) sample volume.
Keywords :
CMOS integrated circuits; capacitive sensors; microfluidics; microsensors; nondestructive testing; permittivity measurement; transceivers; 3D capacitive sensor; MHz-to-GHz DS measurement; MUT; alcoholic beverages; analytic tool; clinical diagnostics; complex relative dielectric permittivity measurement; electrical monitoring modality; electromagnetic wave; fermentation monitoring; food safety control; integrated transceiver IC; material under test; microfluidic-CMOS; molecular characteristics; myriad applications; palmtop dielectric spectroscopy; structural biology; Clocks; Dielectric measurement; Dielectrics; Integrated circuits; Mixers; Radio frequency; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7063088
Filename :
7063088
Link To Document :
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