DocumentCode :
2065688
Title :
23.1 20nm high-K metal-gate heterogeneous 64b quad-core CPUs and hexa-core GPU for high-performance and energy-efficient mobile application processor
Author :
Jungyul Pyo ; Youngmin Shin ; Hoi-Jin Lee ; Sung-il Bae ; Min-Su Kim ; Kwangil Kim ; Ken Shin ; Yohan Kwon ; Heungchul Oh ; Jaeyoung Lim ; Dong-wook Lee ; Jongho Lee ; Inpyo Hong ; Kyungkuk Chae ; Heon-Hee Lee ; Sung-Wook Lee ; Seongho Song ; Chung-Hee Ki
Author_Institution :
Samsung Electron., Hwaseong, South Korea
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
The demands for high-performance smart mobile devices are growing exponentially every year. Like the PC market, 64b CPUs are needed to meet this demand. Furthermore, mobile GPU performance is becoming increasingly important as mobile game graphics requirements are pushing the limits of GPU capabilities. For an enhanced mobile game user experience, a multi-core GPU is required. CPU/GPU power efficiency for longer battery life has been a major interest to consumers for many years. In order to support higher performance and power efficiency, two 64b quad-core CPUs with different microarchitectures and a hexa-core GPU are implemented using Samsung´s 20nm gate-last high-k/metal-gate (HKMG) process.
Keywords :
graphics processing units; mobile computing; mobile handsets; multiprocessing systems; parallel architectures; CPU-GPU power efficiency; HKMG; PC market; Samsung; energy-efficient mobile application processor; gate-last high-k-metal-gate process; hexa-core GPU; high-K metal-gate heterogeneous 64b quad-core CPU; high-performance smart mobile devices; microarchitectures; mobile GPU performance; mobile game graphics requirements; mobile game user experience; multicore GPU; Central Processing Unit; Graphics processing units; Logic gates; Mobile communication; Performance evaluation; Random access memory; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7063105
Filename :
7063105
Link To Document :
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