Foreword

fYear

2009

fDate

26-29 May 2009

Abstract

This paper dealt with the following topics: 3D integration; flip chips; reliability; adhesives and adhesion; optical interconnection and photonic manufacturing; interfacial fracture and lead free-solder reliability; interconnects; alternative solder materials; advanced thermal solutions; embedded components; dynamic, mechanical, and thermal loading; advanced substrates and assembly technology; TSV fabrication and characterisation; lead free process; component materials; high-power laser diodes and LED; wafer level technology; bump reliability; lead free solders; bio-electronics packaging; signal and power integrity; through silicon vias; WLP; CPS materials; printable and organic electronics; thermomechanical modelling and characterization; MEMS, sensors, and embedded packaging; wafer scale assembly; filter and RF; electric modelling and metrology; optoelectronics papers; and, other paper for poster sessions.

Keywords

adhesion; adhesives; circuit reliability; electronics packaging; embedded systems; filters; flip-chip devices; fracture; interconnections; light emitting diodes; micromechanical devices; optoelectronic devices; printed circuits; semiconductor lasers; sensors; 3D integration; CPS materials; LED; MEMS; TSV fabrication; WLP; adhesion; adhesives; alternative solder materials; bio-electronics packaging; bump reliability; electric modelling; embedded components; embedded packaging; filter; flip chips; interfacial fracture; laser diodes; lead free-solder reliability; optical interconnection; optoelectronics; organic electronics; photonic manufacturing; power integrity; printable electronics; sensors; thermal solutions; thermomechanical modelling; through silicon vias; wafer level technology; wafer scale assembly; Assembly; Biological materials; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Materials reliability; Optical materials; Organic materials; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Type

conf

DOI

10.1109/ECTC.2009.5073978

Filename

5073978