DocumentCode :
2066179
Title :
Microelectronics-challenges and changes in the next 15 years
Author :
Bierhenke, Hartwig ; Wieder, Armin W.
Author_Institution :
Siemens AG, Munich, Germany
fYear :
1997
fDate :
8-10 Oct 1997
Firstpage :
1
Lastpage :
7
Abstract :
Microelectronics is set to keep growing at the same pace as in the past for at least the next 15 years. This implies enormous challenges in terms of technology, economics and education. Simultaneously, it opens up huge opportunities for semiconductor and application industries. The progress of microelectronics leads to an exponential growth of “artificial intelligence”. This may help solve serious challenges in various areas of daily life, e.g. in traffic systems, medicine, office and manufacturing technology, environmental issues, resourcing, human and machine communication and in both working and leisure. In order to attain this sort of growth, enormous challenges must to be met by the semiconductor industry in cooperation with the application industry and the nonindustrial research world. This article looks at the crucial areas for the future growth of microelectronics, including CMOS IC development, quantum effect devices, smart power, sensors, packaging, and MEMS technology, and also looks at the economic and educational challenges ahead
Keywords :
CMOS integrated circuits; electric sensing devices; integrated circuit technology; micromachining; micromechanical devices; packaging; power integrated circuits; quantum interference devices; technological forecasting; CMOS IC; IC technology; MEMS technology; artificial intelligence; economics; education; environmental issues; human communication; machine communication; manufacturing technology; medicine; microelectronics; nonindustrial research world; office technology; packaging; quantum effect devices; resourcing; semiconductor application industry; semiconductor industry; sensors; smart power; traffic systems; CMOS integrated circuits; Educational technology; Electronics industry; Environmental economics; Humans; Machine intelligence; Manufacturing industries; Microelectronics; Power generation economics; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
Type :
conf
DOI :
10.1109/EPTC.1997.723877
Filename :
723877
Link To Document :
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