Title :
Ball bond characterization: an intensive analysis on ball size and shear test results and applicability to existing standards
Author :
Aguila, Ma Magdalena T ; Felipe, Roseller C. ; Velarde, Aleli F. ; Edpan, Jonathan B.
Author_Institution :
Allegro Microsyst. Phils. Inc., Paranaque, Philippines
Abstract :
To date, the American Society for Testing and Materials (ASTM) standard is the criterion widely used in the semiconductor industry wherein the minimum ball shear test requirement is based on the wire diameter. Lately, another standard was introduced in the business, the Automotive Electronic Council (AEC) standard, which prescribed a minimum shear reading for a corresponding ball diameter produced. In line with this, this paper presents the characterization made on attributes which could affect the ball formation and shear test results. Moreover, a study was conducted to determine the running capability on ball diameter and ball shear test readings with respect to ASTM and AEC standards
Keywords :
automotive electronics; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; lead bonding; mechanical testing; shear strength; standards; AEC standards; ASTM standards; American Society for Testing and Materials; Automotive Electronic Council; ball bond characterization; ball diameter; ball formation; ball shear test; ball shear test readings; ball size; minimum ball shear; semiconductor industry; shear test; standards; wire diameter; Automotive electronics; Bonding; Councils; Electronics industry; Materials testing; Metallization; Semiconductor device testing; Shearing; System testing; Wire;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723884
