Ball bond characterization: an intensive analysis on ball size and shear test results and applicability to existing standards

Author

Aguila, Ma Magdalena T ; Felipe, Roseller C. ; Velarde, Aleli F. ; Edpan, Jonathan B.

Author_Institution

Allegro Microsyst. Phils. Inc., Paranaque, Philippines

fYear

1997

fDate

8-10 Oct 1997

Firstpage

46

Lastpage

51

Abstract

To date, the American Society for Testing and Materials (ASTM) standard is the criterion widely used in the semiconductor industry wherein the minimum ball shear test requirement is based on the wire diameter. Lately, another standard was introduced in the business, the Automotive Electronic Council (AEC) standard, which prescribed a minimum shear reading for a corresponding ball diameter produced. In line with this, this paper presents the characterization made on attributes which could affect the ball formation and shear test results. Moreover, a study was conducted to determine the running capability on ball diameter and ball shear test readings with respect to ASTM and AEC standards

Keywords

automotive electronics; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; lead bonding; mechanical testing; shear strength; standards; AEC standards; ASTM standards; American Society for Testing and Materials; Automotive Electronic Council; ball bond characterization; ball diameter; ball formation; ball shear test; ball shear test readings; ball size; minimum ball shear; semiconductor industry; shear test; standards; wire diameter; Automotive electronics; Bonding; Councils; Electronics industry; Materials testing; Metallization; Semiconductor device testing; Shearing; System testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723884

Filename

723884