Title :
The simulation of welded microcontact connection of lead and film conductors
Author :
Dyachok, Dmytro ; Smerklo, Lubomyr
Author_Institution :
Lviv Radio Eng. Res. Inst., Ukraine
Abstract :
The models of face and lay-in microcontact connection of lead and film conductors in integrated circuits and microassemblies are considered. It is shown that electrical resistance is an important informative parameter which allows technical analysis of microcontact connections.
Keywords :
electrical contacts; electrical resistivity; equivalent circuits; integrated circuit modelling; lead bonding; Pb; electrical resistance; film conductors; integrated circuits; lead welded microcontact connection; microassemblies; Clamps; Conductive films; Conductivity; Contact resistance; Electric resistance; Equivalent circuits; Microassembly; Thin film circuits; Voltage; Welding;
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Proceedings of the International Conference
Conference_Location :
Lviv-Slavsko, Ukraine
Print_ISBN :
966-553-380-0
