Effect of package construction on thermal performance of plastic IC packages

Author

Bhandarkar, Navin ; Mhaisalkar, Subodh ; Lee, Pauline ; Tracy, Daniel

Author_Institution

Nat. Semicond. Manuf. Singapore Pte Ltd., Singapore

fYear

1997

fDate

8-10 Oct 1997

Firstpage

65

Lastpage

68

Abstract

This paper explores the effect of package geometry and material on the junction-to-ambient thermal resistance (Θ_ja) of plastic IC packages. Only internal package geometry changes are explored here for packages operating under still-air ambient conditions. Among the factors explored in this paper are drop-in heat spreaders, high thermal conductivity mold compounds and die-attach epoxies, and the effect of die-attach delamination. Forced convection and external heatsinks are not studied here, as they can form an extensive topic of study on their own

Keywords

adhesion; encapsulation; finite element analysis; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; microassembling; plastic packaging; thermal conductivity; thermal resistance; FEA; die-attach delamination; die-attach epoxies; drop-in heat spreaders; external heatsinks; forced convection; internal package geometry; junction-to-ambient thermal resistance; package construction; package geometry; package material; plastic IC packages; still-air ambient conditions; thermal conductivity mold compounds; thermal performance; Automatic testing; Delamination; Electronic packaging thermal management; Geometry; Plastic integrated circuit packaging; Semiconductor device packaging; Temperature; Thermal conductivity; Thermal factors; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723887

Filename

723887